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US Patent Issued to IBIDEN on Sept. 22 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,660, issued on Sept. 22, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Jap... Read More


US Patent Issued to Apple on Sept. 22 for "Scalable extreme large size substrate integration" (California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,661, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Scalable extreme large size substrate integration" was invented ... Read More


US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 22 for "Molded thin semiconductor die packages and related methods" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,662, issued on Sept. 22, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Molded thin semiconductor die packa... Read More


US Patent Issued to Intel on Sept. 22 for "Singulation of integrated circuit package substrates with glass cores" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with gla... Read More


US Patent Issued to Kulicke and Soffa Industries on Sept. 22 for "Wire bonding arrays, maintenance stations for wire bonding arrays, and related methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,664, issued on Sept. 22, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire bonding arrays, maintenance stati... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 22 for "Substrate and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,665, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Substrate and method of manufacturin... Read More


US Patent Issued to Yangtze Memory Technologies on Sept. 22 for "Package structures, fabricating methods thereof, and memory systems" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,666, issued on Sept. 22, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Package structures, fabricating methods the... Read More


US Patent Issued to TDK on Sept. 22 for "Electronic circuit package, its manufacturing method, and electronic device having electronic circuit package" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,667, issued on Sept. 22, was assigned to TDK Corp. (Tokyo). "Electronic circuit package, its manufacturing method, and electronic device h... Read More


US Patent Issued to Intel on Sept. 22 for "Dam surrounding a die on a substrate" (Arizona, New Mexico, California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,668, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Dam surrounding a die on a substrate" was invented by Liang H... Read More


US Patent Issued to Intel on Sept. 22 for "Protective coating on an edge of a glass core" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,669, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Protective coating on an edge of a glass core" was invented b... Read More